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Format
Description
Preface. List of Abbreviations. 1: Introduction. 1.1. Outline of the Book. 2: Mapping Problems in the Design Flow. 2.1. Top-Down Flow and Bottom-Up Approach. 2.2. The Mapping Problem. 2.3. Placement and Routing Constraints. 3: Optimization Methods. 3.1. VLSI Optimization Methods. 3.2. Simulated Annealing. 3.3. Concluding Remarks. 4: Optimization Approach Based on Simulated Annealing. 4.1. Optimization Flow. 4.2. Problem Representation. 4.3. Perturbation Operators. 4.4. Acceptance and Generation Functions. 4.5. Temperature Schedule. 4.6. Stop Criterion. 4.7. Cost Function. 4.8. Concluding Remarks. 5: Efficient Algorithms and Data Structures. 5.1. Computational Model. 5.2. Asymptotic Analysis. 5.3. Computational Complexity. 5.4. Data Structures for CAD. 5.5. Concluding Remarks. 6: Placement. 6.1. Previous Work. 6.2. Effective and Efficient Placement. 6.3. Representation Generality, Flexibility and Sensitivity. 6.4. Sequence Pair Representation. 6.5. Graph-Based Packing Computation. 6.6.Non-Graph-Based Packing Computation. 6.7. Graph-Based Incremental Placement Computation. 6.8. Implementation Considerations. 6.9. Experimental Results. 6.10. Placement-to-Sequence-Pair Mapping. 6.11.Constrained Block Placement. 6.12. Concluding Remarks. 7: Routing. 7.1. The Routing Problem. 7.2. Classification of Routing Approaches. 7.3. Previous Work. 7.4. Computational Complexity. 7.5. Global Routing Model. 7.6. Global Routing Algorithms. 7.7. Benchmarking of Heuristics in Our Routing Model. 7.8. Incremental Routing. 7.9. Impact of Routing on Placement Quality. 7.10. Concluding Remarks. 8: Dealing with Physical Phenomena: Parasitics, Crosstalk and Process Variations. 8.1. Previous Work. 8.3. Self-Parasitics. 8.4. Crosstalk. 8.5. Process Variations. 8.6. Incorporating Crosstalk and Parasitics into Routing. 8.7. Incorporating Substrate Coupling into Placement. 8.8. Incremental Substrate Coupling Impact Minimization. 8.9. Concluding Remarks. 9: Conclusions. Bibliography. About the Authors. Index.
Spécifications
Parties prenantes
- Auteur(s) :
- Editeur:
Contenu
- Nombre de pages :
- 210
- Langue:
- Anglais
- Collection :
- Tome:
- n° 751
Caractéristiques
- EAN:
- 9781441953940
- Date de parution :
- 08-10-11
- Format:
- Livre broché
- Format numérique:
- Trade paperback (VS)
- Dimensions :
- 156 mm x 234 mm
- Poids :
- 312 g
