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- 7.000.000 titres dans notre catalogue
- Payer en toute sécurité
- Toujours un magasin près de chez vous
Three-Dimensional Integration and Modeling
A Revolution in RF and Wireless Packaging
Jong-Hoon Lee, Manos M Tentzeris
34,95 €
+ 69 points
Description
This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References
Spécifications
Parties prenantes
- Auteur(s) :
- Editeur:
Contenu
- Nombre de pages :
- 108
- Langue:
- Anglais
- Collection :
Caractéristiques
- EAN:
- 9783031005756
- Date de parution :
- 31-12-07
- Format:
- Livre broché
- Format numérique:
- Trade paperback (VS)
- Dimensions :
- 190 mm x 235 mm
- Poids :
- 217 g
